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Aluminium Nitride (AlN) ceramic is a technical ceramic material renowned for its exceptional thermal conductivity and remarkable electrical insulating properties.
It has a high thermal conductivity that ranges from 160 to 230 W/mK. It exhibits favorable characteristics for applications in telecommunications technology due to its compatibility with both thick and thin film processing techniques.
Consequently, Aluminum Nitride ceramic is widely used as a substrate for semiconductors, high-power electronic devices, housings, and heat sinks.
| Classification | Details |
|---|---|
| Typical Grades |
Grade AN160: 160 W/mK (Hot Pressing) Grade AN180: 180 W/mK (Dry Pressing & Tape Casting) Grade AN200: 200 W/mK (Tape Casting) Grade AN230: 230 W/mK (Tape Casting) |
| Key Properties |
• Very high thermal conductivity • Outstanding thermal shock resistance • Good dielectric properties • Low thermal expansion coefficient • Good metalization capacity |
| Typical Applications |
• Heat sinks & Laser components • High-power electrical insulators • Components for managing molten metal • Semiconductor manufacturing fixtures |






| Properties / Material Grades | AN160 | AN180 | AN200 |
|---|---|---|---|
| Purity (%) | 99 | 96 | 96 |
| Color | Dark Grey / Black | Grey | Grey |
| Density (g/cm³) | ≥3.30 | ≥3.30 | ≥3.28 |
| Flexural Strength (MPa) | >500 | >450 | >350 |
| Thermal Conductivity (W/m·K) | 160 | 180 | 200 |
| Coefficient of Thermal Expansion (10⁻⁶/ºC) | 4.6 | 4.6 | 4.6 |
| Max. Working Temp (Air, ºC) | 800 | 800 | 800 |
| Dielectric Strength (KV/mm) | ≥15 | ≥15 | ≥15 |
| Volume Resistivity (Ω.cm) | >10¹⁴ | >10¹⁴ | >10¹³ |


