High Electrical Insulation 96% 99.6% Al2O3 Substrate Alumina Ceramic Aluminum Oxide Sheet

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Basic Information

Model NO.

Standard

Purity

96% / 99.6% Alumina

Density

Over 3.70g/cm3

Forming Method

Tape Casting

Optional Color

White, Ivory, Pink, Black

Standard Thickness

0.25-2.0mm Available

Thickness Tolerance

0.03mm/0.05mm

Features

High Electrical Insulation, Small Dielectric Loss

Package Size

27.00cm * 17.00cm * 20.00cm

Package Weight

2.000kg

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Product Introduction

Ceramic substrates are ideal packaging base materials for new generation integrated circuits and power electronic modules. Compared with plastic and metal substrates, ceramic substrates have significant advantages:

1. Good Insulation: Ceramic materials are generally covalent bond compounds with superior insulation properties for high package reliability.

2. Low Dielectric Coefficient: Low dielectric constant and loss reduce signal delay and increase transmission speed.

3. Small CTE: High melting points result in a small coefficient of thermal expansion (CTE).

4. High Thermal Conductivity: Widely used in high-reliability, high-frequency, and high-temperature product packaging in aviation and aerospace industries.

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Product Parameters

Item / Unit			96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/		White	White
Density	Drainage Method	g/cm³	≥3.70	≥3.95
Flexural Strength	Three Point Bending	MPa	>350	>500
Vickers Hardness	Load 4.9N	GPa	14	16
Thermal Properties
Max. Service Temp	ºC		1200	1400
Thermal Conductivity	25ºC	W/m·K	>24	>29
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Volume Resistivity	25ºC	Ω·cm	≥10¹⁴	≥10¹⁴

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Product Applications

1. 96% Alumina

Standard material for thick film circuit substrates. Features excellent electrical insulation, mechanical strength, and dimensional stability. Surface roughness: 0.2-0.6um.

2. 99.6% Alumina

Used primarily in thin film circuit substrates. Features higher purity, smaller grain size, and excellent surface smoothness (0.08-0.1um). Operating temperature up to 1700°C.

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Manufacturing Capacity

Standard Tolerances:

Item	Thickness (mm)	Standard Tol. (mm)	Laser Cutting Tol. (mm)
Length/Width	/	±2	±0.15
Thickness	T<0.3	±0.03	/
Thickness	0.30-1.0	±0.05	/

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Production & Inspection

Production Process Flow:

Quality Inspection:

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Product Recommendations

We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses.

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Frequently Asked Questions

What are the main advantages of ceramic substrates?

Ceramic substrates offer superior electrical insulation, low dielectric loss, a low coefficient of thermal expansion (CTE), and high thermal conductivity compared to plastic or metal alternatives.

What is the difference between 96% and 99.6% alumina?

96% alumina is the standard for thick film circuits with a roughness of 0.2-0.6um, while 99.6% alumina is used for thin film circuits, offering higher purity, smaller grain size, and a smoother surface (0.08-0.1um).

What are the maximum operating temperatures for these sheets?

The 96% alumina substrate can withstand temperatures up to 1600°C, while the 99.6% alumina substrate can reach up to 1700°C.

Can these ceramic substrates be customized in size?

Yes, while we have standard sizes (ranging from 0.1mm to 2.0mm thickness), we provide customized shapes including rectangular, square, and round through various molding and lapping techniques.

What kind of laser processing can be performed?

We support high-precision laser processing including hole drilling (with diameters ≤0.5mm or >0.5mm) and laser scribing with depth accuracies of ±0.01mm.

In which industries are these substrates commonly used?

They are widely utilized in aviation, aerospace, high-frequency engineering, and for packaging hybrid integrated circuits (HIC) and multi-chip modules (MCM).